Analysis
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XPS/UPS Escalab 250Xi, XPS K-Alpha
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- Quantitative chemical and molecular surface spectroscopy (< 10 nm)
- Chemical mapping 2D (3 μm lateral resolution)
- Polymers depth profiling (deepness)
- Ar+ ions
- Ar+ clusters sources (organic materials profiling)
- Typical depth of analysis 1-10 nm. Typical lateral resolution 0.5-3 µm
- UV photoemission spectroscopy – valence balance
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ION BEAM ANALYSIS (IBA)
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Tandetron Linear Accelerator (ALTAÏS) – Characterization
- Quantitative (sensitivity ~10 wt.ppm)
- Non-destructive
- Model-free
- Depth profiling (depth resolution ~1-10 nm)
- 2D elemental maps (lateral resolution ~1 µm), microprobe (µPIXE available)
- H depth profiling capability
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ToF-SIMS IV, IONTOF
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- Beam line for ion implantation
- Molecular surface spectroscopy
- Semi quantitative (with standards)
- Very sensitive
- Chemical mapping
- Profiling (deepness)
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CELL IRRADIATION
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Tandetron Linear Accelerator (ALTAÏS) – Irradiation: Large and uniform beam (~ 0.5cm²)
- Radiobiology station (cells irradiation)
- Vacuum & non vacuum beam line for radiobiology
- Irradiation station
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Synthesis
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ION BEAM IMPLANTATION
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- Beam line for ion implantation
- Vacuum & non vacuum beam line for atomic and nuclear spectroscopies
- UHV and very low noise beam lines for surface and interface analysis
- Non-destructive quantitative characterization
- Composition and thickness of thin films (a few microns)
- Adaptable geometry measurement
- Polymers and biological samples analysis
- Sample size: maximum 20 mm in diameter
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PLASMA-BASED SURFACE TREATMENT
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Plasma sputtering: 4 chambers for plasma sputtering (DC, RF and AC)
- Plasma functionalization
- Thin films deposition
PECVD deposition: 4 chambers for PECVD deposition and functionalisation
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